Politeknik SCI, Cirebon – West Java

Welcome to
The 3rd INCOSST 2026

The 3rd International Conference on Smart Science and Technology 2026

Cirebon, West Java, Indonesia  –  8 August 2026

Conducting in-depth research on future AI technologies

We are pleased to announce that Politeknik SCI Cirebon, Indonesia will host the 3rd International Conference on Smart Science and Technology (INCOSST) 2026. The conference will be held in a hybrid format (both onsite and online) on August 8, 2026, at the Politeknik SCI Cirebon campus in West Java, Indonesia. This event will serve as a platform for exchanging cutting-edge ideas and systems in the fields of Computer Science and Electrical Engineering, with a focus on System Modeling, Information & Communication Technology (ICT), Data Science, Artificial Intelligence (AI), Machine Learning (ML), and Digital Applications.

We invite academics, researchers, and practitioners to participate in The 3rd INCOSST 2026 at Politeknik SCI Cirebon. This conference will facilitate research-based discussions on the latest developments, challenges, and innovations in Modeling, Artificial Intelligence, Data Science, and Digital Applications. We welcome paper submissions on various topics related to system modeling, ICT, data science, AI, and ML. Submissions aligned with the conference theme are particularly encouraged. Accepted papers will be categorized into several tracks based on their technical fields, including but not limited to the following areas:

Modeling

  • Data Modeling and Visualization
  • Enterprise Modeling on Data & Information
  • Data Management for Analytics
  • Statistics Exploratory Data Analysis
  • Data Structures and Data Management
  • City Data Management
  • Deep Learning and Big Data
  • Social Web Search and Mining
  • Big Data as a Service
  • Web Analytics

Computing and Processing

  • Soft Computing
  • Fuzzy Logic and Artificial Neural Networks
  • Mathematical Modeling and Simulation
  • Data Mining, Web Technology and Ontology
  • Cloud Computing
  • Green Computing
  • Mobile Computing
  • Nanoelectronics and Quantum Computing
  • Big Data
  • Internet Of Things

Artificial Intelligence, Automation and Control

  • Intelligent Instrumentation 
  • Automation in Mechanical Manufacturing
  • Automation Control System
  • Artificial Intelligence and Machine Learning
  • Intelligent System Design
  • Intelligent Decision Support
  • Intelligent Robot & Sensors
  • Embedded Systems Design
  • Vehicular Technology
  • Control Systems



NO-SHOW PAPER POLICY
Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.
The committee reserves the right to exclude a paper from distribution after the conference if the paper is not presented at the conference.

Important Dates

BATCH 1

Full Paper Submission Deadline: 31 January 2026

Acceptance Notification: 22 February 2026

Payment Registration: 15 March 2026

Upload Final Manuscript: 8 April 2026

BATCH 2

Full Paper Submission Deadline: 17 March 2026

Acceptance Notification: 28 March 2026

Payment Registration: 30 March 2026

Upload Final Manuscript: 8 April 2026

Conference Day: 8 AUGUST 2026

Meet our speakers

To Be Announced​

To Be Announced
TECH
AI
To Be Announced
ROBOTICS
AI
To Be Announced
DEVELOPER
NO-CODE
To Be Announced
MACHINE LEARNING
TECH

Committee

Steering Committee
Dr. Abdurokhim

General Chair
Chiska Nova Harsela, S.T.P., M.T.

Technical Program Committee
Lala Huca Dinota A.M., Ph.D.

Publication Chair
Ega Nur Fadillah, M.Pd.

Treasurer
Anisa Ayu D.L., S.E.

Day 1

20 Feb, 2024

Dr. Alex Miller

10:15 AM - 11:15 AM

Ethical considerations in artificial intelligence

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Michael Johnson

10:15 AM - 11:15 AM

Revolutionizing computing: Quantum leap ahead

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Emily Rodriguez

10:15 AM - 11:15 AM

Smart cities and sustainable transportation

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Michael Johnson

10:15 AM - 11:15 AM

Real-world applications of blockchain

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Emily Rodriguez

10:15 AM - 11:15 AM

Next-Gen robotics: Enhancing workplaces

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TPC Members and Reviewers

TitleFull NameAffiliationCountry
Prof.Dhwani ModiGujarat Technological UniversityIndia
Prof.Fatiha MerazkaLISIC Laboratory. USTHB UniversityAlgeria
Prof.Jagbeer SinghMeerut Institute of Engineering and Technology MeerutIndia
Prof.John Joshua F. MontañezBicol State College of Applied Sciences and TechnologyPhilippines
Prof.Madhan Kumar SrinivasanInfosys LimitedIndia
Prof.Nancy KumariSRM ISTIndia
Prof.Perry Neil FernandezUniversity of the Philippines VisayasPhilippines
Prof.Pravin C LataneSavitribai Phule Pune UniversityIndia
Dr.Anurag ThantharateUniversity of Missouri Kansas CityUSA
Dr.Ashwani KumarSant Longowal Institute of Engineering and TechnologyIndia
Dr.Bharanidharan GurumurthyUniversity of MadrasIndia
Dr.Binh Tieu HoangCMC UniversityVietnam
Dr.Chaima AouicheEchahid Cheikh Larbi Tebessi UniversityAlgeria
Dr.Francisco Gerardo Hernandez-RiveraUniversidad Autonoma de CoahuilaMexico
Dr.Incosst PolteksciPoliteknik Siber Cerdika InternasionalIndonesia
Dr.Jingye YeeFraunhofer IEMGermany
Dr.Karl LeungHong kong Instittute of Vocational EducationHong Kong
Dr.Lala Hucadinota Ainul AmriPoliteknik Negeri MadiunIndonesia
Dr.Mario Alberto Ibarra-ManzanoUniversidad de GuanajuatoMexico
Dr.Ming YingZhejiang UniversityChina
Dr.Mustapha BouakkazUniversity of Laghouat – LIM Laboratory AlgeriaAlgeria
Dr.Nadia AwadBabylon Technical Institute/Al-Furat Al-Awsat Technical UniversityIraq
Dr.Patcharaporn PanwongMae Fah Luang UniversityThailand
Dr.Puwis ThiparpakulKing Mongkut’s University of Technology ThonburiThailand
Dr.Rijo JoyUniversity of the CumberlandsUSA
Dr.Riko Arlando SaragihMaranatha Christian UniversityIndonesia
Dr.Rishabh DasOhio UniversityUSA
Dr.Rosyid R Al-HakimUniversitas Harapan BangsaIndonesia
Dr.Sandhya KattayatHigher Colleges of TechnologyUnited Arab Emirates
Dr.Seema Gangaiah AarellaAustin CollegeUSA
Dr.Shashikant S. PatilAtlas SkillTech University Kurla WestIndia
Dr.Siamack GhadimiBrno University of TechnologyCzech Republic
Dr.Sokratis VavilisInlecom InnovationGreece
Dr.Somesh K Dewangan, SrChhattisgarh Swami Vivekanand Technical University BhilaiIndia
Dr.Sushanth S. ManakhariGannon UniversityUSA
Dr.Terefe Hanchiso SodangoWolkite UniversityEthiopia
Dr.Vasileios AlevizosKarolinska institutetSweden
Dr.Vian SabeehTechnical College of ManagementIraq
Dr.Zhifeng ChenNeusoft Medical SystemsChina
Ms.Khadija Ateya AlmohsenAmerican University of BahrainBahrain
Ms.Mantisha GuptaShri Mata Vaishno Devi UniversityIndia
Ms.Sri Vidya BommineniIndependent ResearcherUSA
Ms.Sridevi PalepuAT&TUSA
Mrs.Nor Amizam JusohUCYP UniversityMalaysia
Mrs.Ranyah Ghaleb TahaAl Iman SchoolBahrain
Mrs.Reem Majid ShukurDiyala UniversityIraq
Mrs.Rifda Faticha Alfa AzizaUniversitas Amikom YogyakartaIndonesia
Mrs.Sakshi MittalIndependent ResearcherUSA
Dr.Zakia ZouaghiaUniversity of TunisTunisia
Mr.Abdelali ZbakhAbdelmalek Essaâdi UniversityMorocco
Mr.Ade BastianUniversitas MajalengkaIndonesia
Mr.Adi HermansyahUniversitas SriwijayaIndonesia
Mr.Agus NursikuwagusInstitut Teknologi BandungIndonesia
Mr.Ahmad Ashraf Abdul HalimCo-authorMalaysia
Mr.Anawin PechbooraninSuranaree University of TechnologyThailand
Mr.Anggit Ferdita NugrahaUniversitas AMIKOM YogyakartaIndonesia
Mr.Arun Ambika SasikumarCradlepointUSA
Mr.Bharath Kumar MittapallyReveal Global ConsultingUSA
Mr.Chakra Pavan Kumar KotaWalmartUSA
Mr.Chetan RBNM Institute of TechnologyIndia
Mr.Cucun Very AngkosoUniversity of Trunojoyo MaduraIndonesia
Mr.Dhanunjaya rao GorrleWestern Digital Technologies INcUSA
Mr.Enguang FanUniversity of Illinois at Urbana-ChampaignUSA
Mr.Jawahar Ravee NithianandamAetna Resources LLCUSA
Mr.Joyanto RoychoudharyMeghnad Saha Institute of TechnologyIndia
Mr.Kabilan KannanAMDUSA
Mr.Manjunatha Sughaturu KrishnappaOracleUSA
Mr.Mohanraj BSona College of TechnologyIndia
Mr.Muhammad ZamanCOMSATS University IslamabadPakistan
Mr.Pramath ParasharBHP Minerals Service CompanyUSA
Mr.Prithvish Rakesh DoshiCharacterQuiltUSA
Mr.Raj MehtaTrimble, Inc.USA
Mr.Rengga AsmaraPoliteknik Elektronika Negeri SurabayaIndonesia
Mr.Sandeep Kumar AgrawalRJIT TekanpurIndia
Mr.Shu LIInriaFrance
Mr.Syed Manzoor QasimKing Abdulaziz City for Science and TechnologySaudi Arabia
Mr.Vinay MallikarjunaradhyaThomson ReutersUSA
Mr.Yoga PristyantoUniversitas Amikom YogyakartaIndonesia

Registration Fee

Payment can be made once the manuscript has been ACCEPTED.

Registration Payment for Overseas Participants can be made directly at EDAS: https://edas.info/r34481

Registration Payment for Domestic Participants can be made by bank transfer, with the following details:

Account Name: POLITEKNIK SIBER CERDIKA INTERNASIONAL

Name of Bank: Bank BRI

Account Number: 107801001476307

SWIFT Code: BRINIDJAXXX

NOTE: INCOSST – Id Paper

To make it easier to check, please add the last 3 digits of your ID paper to the registration fee.

Confirmation is manual, meaning you must inform and send proof of transfer at this Form Confirmation.

 

BATCH 1 (Submit Paper until 31 January 2026)
Participant CategoryOverseas Domestic 
Student (IEEE Member)US$ 200IDR 2,250,000
Student (Regular/Non IEEE Member)US$ 225IDR 2,400,000
Profesional (IEEE Member)US$ 275IDR 2,750,000
Profesional (Regular/Non IEEE Member)US$ 300IDR 3,000,000
Extra Paper (2nd, 3rd paper)US$ 200IDR 2,250,000
Attendee (without paper)US$ 25IDR 250,000
 
BATCH 2 (Submit Paper AFTER 31 January 2026)
Participant CategoryOverseas Domestic 
Student (IEEE Member)US$ 230IDR 2,450,000
Student (Regular/Non IEEE Member)US$ 280IDR 2,800,000
Professional (IEEE Member)US$ 305IDR 3,050,000
Professional (Regular/Non IEEE Member)US$ 330IDR 3,300,000
Extra Paper (2nd, 3rd paper)US$ 230IDR 2,450,000
Attendee (without paper)US$ 25IDR 250,000
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Melina Doe

Digital Marketer

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Sair Doe

Business Owner

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